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《轉貼》"The semiconductor industry is trending towards chiplet-based architectures that rely on transformative packaging innovations to deliver critical power and performance requirements," commented Yin Chang, ASE’s Senior Vice President of Sales & Marketing. He continued, "As industry leader, ASE brings advanced packaging inclusion to the table by offering a broad portfolio of system integration technologies, including FOCoS-CF and FOCoS-CL, under our VIPack™ platform, geared towards enabling the world’s foremost applications such as HPC, artificial intelligence, 5G, and automotive."

"The magic of FOCoS-CF and FOCoS-CL is that we are able to optimize integration possibilities by scaling the electrical connectivity in fan-out to interconnect multiple different chips, simultaneously achieving both heterogeneous and homogeneous integration where chips are split up and combined within a fan-out package,’" said Dr. C.P. Hung, Vice President of R&D, ASE. He added, "This innovative technology approach is an industry first and provides considerable competitive advantage for our customers in meeting stringent miniaturization, bandwidth, latency, and other evolving design and performance requirements."

https://finance.yahoo.com/news/ase-...-150000095.html